Place of Origin: | China |
Brand Name: | Ziitek |
Certification: | RoHS |
Model Number: | TIE280-25AB |
Minimum Order Quantity: | 5can |
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Price: | USD 1-50 / can |
Packaging Details: | 1kg/can |
Delivery Time: | 3-7 work days |
Payment Terms: | T/T |
Supply Ability: | 100000can/month |
Usage: | Potting | Package: | 1kg/can |
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Shelf Life @25℃ In Sealed Container: | 12month | Color: | Black |
Name: | Two Compound Thermal Conductive Epoxy Glue | Material: | Epoxy Glue |
High Light: | circuit board potting compound,high voltage potting compound,Black Thermally Conductive Potting Compound |
Ziitek high conductivity black two compound thermal conductive epoxy glue 85shoreD for potting coils
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
TIE™ 280-25AB is a two compound, high thermal conductive, low temperature cured, long pot life, fire resistant epoxy encapsulant compound. It is design for potting of capacitors and electrical devices.
Features
> Good thermal conductive: 2.5W/mK
> Excellent insulation and smoothly sourface.
> Low shrinkage
> Low viscosity, expediting air releaseed.
> Excellent in solvents and water proof.
> Longer life time.
> Excellent thermal shock efficiecy and impact resistance
Application
Handheld portable electronics |
Semiconductor automated test equipment (ATE) |
CPU |
display card |
mainboard/mother board |
notebook |
power supply |
Heat pipe thermal solutions |
Memory Modules |
Mass storage devices |
Automotive electronics |
Set top boxes |
Typical Uncured Material TIE™ 280-25A (Resin) | |
Color | Black |
Viscosity@25℃ Brookfield | 3,000 cPs |
Specific Gravity | 2.1 g/cc |
Shelf life @25℃ in sealed container | 12 months |
TIE™ 280-25B (Hardener) | |
Color | Black |
Viscosity@25℃ Brookfield | 5,000 cPs |
Shelf life @25℃ in sealed container | 12 months n |
Viscosity @25℃ | 4,000 cPs |
Working pot life (250 g @25℃) | 45 min |
Specific Gravity | 2.1g/ccn |
Cure Schedule | |
Cure 12 hours at 25℃ | |
Cure 30 minutes at 70℃ |
Cured Properties | |
Hardness @25℃ | 85 Shore D |
Service temperature | -40℃ to +130℃ |
Glass transition temperature Tg | 92℃ |
Elongation | 0.10% |
Coefficient of thermal expansion, / ℃ | 3.0 X 10-5 |
Fire resistance UL | Meet 94 V-0 |
Moisture absorption % wt gain 24 hours water immersion @25℃ | 0.1 |
Thermal | |
Thermal Conductivity | 2.5 W/m-K |
Thermal Impedance @10psi | 0.31 ℃-in²/W |
ELECTRICAL AS CURED | |
Dielectric Strength | 300 volts / mil |
Dielectric Constant | 4.2 MHz |
Dissipation factor | 0.029 MHz |
Volume resistivity, ohm-cm @ 25℃ | 3.0 X 1012 |
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
Contact Person: Miss. Dana
Tel: +86 18153789196